 |  | | | | | | |  | | SEMICONDUCTORS | | | | • Roughening wafer chucks
• Drilling of electrodes for Plasma etching
• Forming holes completely through IC packages
• Etching of silicon wafer
• Boring of glass wafer
• Etching of ceramics wafer susceptor | | Etching of silicon wafer | | | | ELECTRONIC COMPONENTS | | | | • Roughening reverse surfaces of SAW filter
substrate
• Forming electrodes of ceramic filters
• Grooving of printer heads
• Etching of crystal device
• Stain removal and micro deburring of condensers
• Drilling of sensor glass substrate
• Suface cleaning of IC package | | Surface cleaning of IC package | | | | FLAT PANEL DISPLAYS RELATED | | | | • Forming ribs on PDP
• Grooving of LCD glass substrate
• Etching of metallic mold for LCD filter
• Etching of OELD cover glass
• Peeling thin firm layer of silicon substrate or
glass substrate | | Etching of glass substrate | | | | MEMS | | |
| • The micro-stracture is etched and formed on
PZT piezoelectric materials | | | | OTHERS | Deburring of Aluminum Board  before  after | | • Etching of metallic foils (aluminum,copper)
• Cutting of quartz glass
• Rib forming of alumina substrate
• Roughening metallic mold
• Etching of stainless steel
• Deburring of metallic parts | | | | | Materials | • Glass
• Carbon
• Quartz | • Silicon
• A13N4
• Sapphire | • Ceramics
• A1303
• Metal etc.
(Stainless steel, steel, etc.) | | Applications | • Grooving
• Via hole
• Cleaning
• Slitting
• Gettering
• De-smear
• Forming | • Boring
• Etching
• Deburring
• Patterning
• Marking
• Beveling
etc. | • Through hole
• Cutting
• Peeling
• Dicing
• De-marking
• Roughening | |
